IANS | 13 Mar, 2024
Giving a push to his vision to position India as a global hub for
semiconductor design, manufacturing and technology development, Prime
Minister Narendra Modi will lay the foundation stone of three
semiconductor projects worth about Rs 1.25 lakh crore on Wednesday via
video conferencing.
While fostering the creation of employment
opportunities, PM Modi will also address the youth across the country,
as the programme will see participation of youngsters, including
thousands of college students, along with leaders from the semiconductor
industry.
The foundation stone is being laid for the
semiconductor fabrication facility at the Dholera Special Investment
Region (DSIR) in Gujarat; Outsourced Semiconductor Assembly and Test
(OSAT) facility at Morigaon, Assam; and the OSAT facility at Sanand,
Gujarat.
The Dholera facility will be set up by Tata Electronics
under the modified scheme for setting up semiconductor fabrication in
India.
With a total investment of over Rs 91,000 crore, this will
be the first commercial semiconductor fabrication facility in the
country.
The OSAT facility in Morigaon, Assam will be set up by
Tata Electronics Private Limited (TEPL) under the Modified Scheme for
Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with a
total investment of about Rs 27,000 crore.
The OSAT facility in
Sanand, Gujarat, will be set up by CG Power and Industrial Solutions
Limited with a total investment of about Rs 7,500 crore.
Through these facilities, the semiconductor ecosystem will be strengthened and will get a firm footing in India.
These
units will also provide employment to thousands of youth in the
semiconductor industry as well as catalyse employment generation in
related sectors like electronics and telecom, etc.
